Scale up of advanced packaging and system integration for hybrid technologies

This paper presents an overview of challenges in system integration for 2.5D/3D assemblies, including copackaged optics and electronics, MEMS and microfluidics. It addresses the gap between early-stage prototypes and volume manufacturing that need true advanced packaging and system integration to realize their complex multi-technology devices. This is done by means of a virtual demonstrator that include both 2.5D/3D assemblies of ASICs and integrated photonic devices, as well as MEMS and microfluidics devices. It also addresses lowering the cost barrier for users accessing these technologies for their products, such that it will enable an increased uptake of system integration by the industry at large

Silicon photonics open access foundry services review for emerging technology

This paper presents a summary review of some of the available foundry services offering Silicon Photonics, comparing the key technologies available to European technology innovators that drive the technology sector. The foundries providing these unique technologies include AMF, CEA Leti, CORNERSTONE, Global Foundries, ihp, imec, and LioniX International. The review will also show examples of Silicon Photonics in emerging application domains from selected foundries